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HIGH TEMPERATURE FIRED-ON CIRCUIT MATERIALS

Silver  Platinum Gold Rhodium Palladium & Sealing Glass Paste

PRODUCTS

RHODIUM

8785

Platinum/Rhodium Electrode Paste

Screen printable, fluxed paste designed for making high temperature resistant electrodes on a variety of ceramic substrates. The fired film, which is suitable for direct soldering, is highly conductive and exhibits excellent adhesion to most ceramic bodies.

Applications: Primary applications include making terminations and circuits for use in corrosive or halogenated environments. Can also be used for printing high-reliability fine line microcircuits where the print resolution is required to have 5 mil lines and spaces

8785-FR

Platinum/Rhodium Electrode Paste (Fritted)

Screen printable, fritted paste designed for making high temperature, ultra corrosion resistant electrodes on a variety of ceramic substrates. The fired film, which is suitable for direct soldering, is highly conductive and exhibits excellent adhesion to most ceramic bodies.

Applications: Primary applications include making terminations and circuits for use in corrosive or halogenated environments. Can also be used for printing high-reliability fine line microcircuits where the print resolution is required to have 5 mil lines and spaces

8785-MBR

Platinum/Rhodium Electrode Paste - Mixed (Reactive) Bonded

Screen printable, mixed (reactive) bonded, paste designed for making high temperature, ultra corrosion resistant electrodes on a variety of ceramic substrates. The fired film is highly conductive and exhibits excellent adhesion to most ceramic bodies.

Applications: Primary applications include making terminations and circuits for use in corrosive or halogenated environments. Can also be used for printing high-reliability fine line microcircuits where the print resolution is required to have 5 mil lines and spaces

8785-NF

Platinum/Rhodium Electrode Paste (Non Fritted)

Screen printable, non fritted paste designed for making high temperature, ultra corrosion resistant electrodes on a variety of ceramic substrates. The fired film, which is suitable for direct soldering, is highly conductive and exhibits excellent adhesion to most ceramic bodies.

Applications: Primary applications include making terminations and circuits for use in corrosive or halogenated environments. Can also be used for printing high-reliability fine line microcircuits where the print resolution is required to have 5 mil lines and spaces

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